QuesTek to present progress on design of new Cuprium™ alloy to replace toxic copper-beryllium in bushing applications
Evanston, IL, February 28, 2008 – As part of a U.S. Navy Phase II SBIR program with NAVAIR, QuesTek Innovations LLC is using its computational materials design technology to develop the Cuprium™ class of beryllium-free copper alloys for replacement of AMS 4533 Cu-Be alloy. Existing copper-berryllium alloys achieve high strengths (>140 ksi yield strength) that are not possible in other copper-based alloys and have widespread Department of Defense application; especially in aerospace bushings. However, beryllium is highly toxic in certain forms and requires great care during machining and other production processes. OSHA is calling for further reductions in beryllium exposure limits, causing product designers to avoid Cu-Be alloys in key applications. As a result, a number of aerospace companies are actively seeking beryllium-free bushing technologies.
QuesTek’s new Cuprium alloy will be the only suitable “drop-in” replacement for existing Cu-Be alloys, meeting all key performance criteria. The new alloy will eliminate the health hazards associated with toxic beryllium and, as a drop-in replacement, minimize product re-design costs. QuesTek plans to present the latest developments of the Cuprium alloy at the Navy Opportunity Forum to be held at Crystal City, VA from June 2nd-4th, 2008.
QuesTek Innovations LLC (www.questek.com) is a global leader in Integrated Computational Materials Engineering (ICME) technologies, serving government and industrial private sectors. Using its proprietary Materials by Design® methodology, QuesTek has rapidly developed breakthrough alloys (based on Fe, Cu, Al, Ti, Co, Mo, W systems), coatings, powders, and other materials that provide improved performance, reduced capital (as well as operating and maintenance costs) and provide competitive advantage. QuesTek has developed four steels that are being used in demanding aerospace and other applications, has a large portfolio of other materials nearing commercialization with more than 20 US patents awarded/pending and relevant international IP coverage. For more information, please contact Jeff Grabowski.