Jiadong Gong, Ph.D.
Manager of Modeling and Software Development
Ph.D. Materials Science and Engineering, Northwestern University, 2012
Management for Scientists and Engineers, Kellogg School of Management, Northwestern University, 2012
M.S. Materials Science and Engineering, Tsinghua University, 2008
B.S. Materials Science and Engineering, Tsinghua University, 2006
Current Role at QuesTek
Jiadong Gong, Ph.D. serves as the principal expert and technical leader on the QuesTek’s methodology and technology, especially on the ICME and Materials Design, which are the core to design and development of novel materials and processes. As the Technical Fellow, he provides leadership to QuesTek's engineering team and he acts as Principal Investigator in our key programs with DoD (e.g. DARPA, Air Force, Navy, etc.), DoE, NASA, and commercial clients. He manages a group of talented engineers in our Modeling & Software Development team to design and develop novel materials using materials genomic big data and advanced computational tools/software under the Integrated Computational Materials Engineering (ICME) framework. At QuesTek, he leads the systems design practice and technical activities, including advanced materials for the area of aerospace, automotive, energy and electronics applications and additive manufacturing (3D Printing). He serves on multiple committees at TMS and he is an inventor with multiple patents in the U.S. and worldwide.
Jiadong also leads QuesTek's international business development and expansion currently focusing on Asia/Japan. Another new venture he is actively involved is the Accelerated Qualification for Additive Manufacturing.
Background and Specialization
Prior to joining QuesTek, he served as the principal teaching assistant of the Materials Design class at Northwestern University, where the full range of computational tools for materials design and accelerated development were taught and applied in a variety of projects. He also did research on magnetic and thermal properties in electronic devices in his early academic years. His Ph.D. study was focused on the advanced alloys and process optimization for automotive applications. His Ph.D. dissertation is entitled: “Predictive Process Optimization for Fracture Ductility in Automotive TRIP Steels.”
Honors, Awards and Patents
Jiadong is the inventor or co-inventor of several patents, in the filed of corrosion resistant high strength steel, Ni-base superalloy, and additive manufacturing technology etc. His honors and awards include receiving the Integrated Excellence Scholarship at Tsinghua University and the Graduate Student Leader of the Year award at Northwestern University for 2010-2011.
Publications and Presentations
- J Zhao, J Gong, A Saboo, DC Dunand, GB Olson, “Dislocation-based modeling of long-term creep behaviors of Grade 91 steels”, Acta Materialia 149, 19-28, 2018
- Jiadong Gong, et. al., “ICME design of a castable, creep-resistant, single-crystal turbine alloy”, JOM 69 (5), 880-885, 2017
Jiadong Gong, et. al., “Integrated Thermal Process Optimization of Alloy 718Plus® for Additive Manufacturing”, Superalloys, 2016
- AD Peralta, M Enright, M Megahed, J Gong, M Roybal, J Craig, “Towards rapid qualification of powder-bed laser additively manufactured parts”, Integrating Materials and Manufacturing Innovation 5 (1), 8, 2016
- Y Idell, LE Levine, AJ Allen, F Zhang, CE Campbell, GB Olson, J Gong, “Unexpected δ-phase formation in additive-manufactured Ni-based superalloy”, JOM 68 (3), 950-959, 2016
- J Gong, D Snyder, J Sebastian, G Olson, “Materials Genomic Design of Novel Alloys with CALPHAD Tools” TMS 2015, 99-106, 2015
- Jiadong Gong, et. al., “Computational Design of a Novel Co‐Base Alloy for Cu‐Be Replacement”, CALPHAD, 349, 2015
- Jiadong Gong, Invited talk on "Predictive Process Optimization for Fracture Ductility in Automotive TRIP Steels", MS&T, Montreal, Canada, October 2013
- Jiadong Gong, “Fracture Ductility Design of Automobile TRIP Steels for Hole Expansion Optimization”, SRG 28th Annual Conference, Evanston, IL, March 2012
- Jiadong Gong and Dan Wei, “Comparison of Micromagnetic and Point Probe Model in Magnetic Force Microscope Simulation,” IEEE Transactions on Magnetics, Vol. 43, No. 10, October 2007